Manifold cover for use in a semiconductor wafer heat processing apparatus



FIG. 1 a perspective view of a cover manifold cover for use in a semiconductor wafer heat processing apparatus;

FIG. 2 a front elevational view thereof;

FIG. 3 a rear elevational view thereof;

FIG. 4 a top plan view thereof;

FIG. 5 a bottom plan view thereof;

FIG. 6 a right side view thereof;

FIG. 7 a left side view thereof; and,

FIG. 8 a cross-sectional view taken along line VIII-VIII in FIG. 2. 

I claim the ornamental design for a manifold cover for use in a semiconductor wafer heat processing apparatus, as shown and described. 